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Double-sided TMM4 PCB 15mil Thick with Immersion Gold Finish

Produits

Panneau de carte PCB de Rogers

L'impédance a commandé la carte PCB

Laminés revêtus de cuivre

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Ms. Ivy Deng

sales10@bichengpcb.com

86-755-27374847

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Double-sided TMM4 PCB 15mil Thick with Immersion Gold Finish

Nombre De Pièces:	1 pièces
Prix:	USD9.99-99.99
Emballage Standard:	Sacs sous vide + Cartons
Période De Livraison:	8-9 jours ouvrables
Méthode De Paiement:	T/T
Capacité D'approvisionnement:	5000 pièces par mois

Détails Informations

Description du produit

Informations détaillées

Lieu d'origine

Chine

Nom de marque

Bicheng

Certification

UL, ISO9001, IATF16949

Numéro de modèle

BIC-470.V1.0

Matériau de base:

Rogers TMM4

Nombre de couches:

2 couches

Épaisseur du PCB:

0,5 mm

Taille du PCB:

102 mm x 85 mm par pièce, avec une tolérance de +/- 0,15 mm

Masque de soudure:

5000 mètres par semaine

Sérigraphie:

5000 mètres par semaine

Poids du cuivre:

1 oz (1,4 mils) pour les couches extérieures

Finition de surface:

Immersion Or

Mettre en évidence:

Double-sided TMM4 PCB

15mil thick immersion gold PCB

Rogers PCB with gold finish

Description du produit

This PCB is a high-performance 2-layer rigid board, constructed with strict adherence to industry standards and precise specifications to ensure reliability and functionality. It adopts Rogers TMM4 thermoset microwave material as the base material, which is suitable for RF and microwave circuitry, satellite communication systems, GPS antennas and other high-frequency applications.

PCB specification

Item	Details
Base Material	Rogers TMM4
Layer Count	2 layers (no blind vias)
Board Dimensions	102mm x 85mm per piece, with a tolerance of +/- 0.15mm
Minimum Trace/Space	5/7 mils
Minimum Hole Size	0.4mm
Finished Board Thickness	0.5mm
Finished Copper Weight	1oz (1.4 mils) for outer layers
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Silkscreen	No silkscreen on both top and bottom layers
Solder Mask	No solder mask on both top and bottom layers
Quality Control	100% Electrical test conducted prior to shipment

PCB Stack-up

Layer	Specifications & Descriptions
Copper Layer 1	35 μm (1oz finished copper)
Rogers TMM4 Core	0.381 mm (15 mil) core substrate
Copper Layer 2	35 μm (1oz finished copper)

Double-sided TMM4 PCB 15mil Thick with Immersion Gold Finish 0

Artwork and Standard

Type of Artwork Supplied: Gerber RS-274-X, the global industry standard for PCB fabrication, compatible with mainstream manufacturing equipment and software to ensure accurate design data transfer and reduce fabrication errors.

Accepted Standard: IPC-Class-2 (formulated by IPC), a widely used PCB quality standard that ensures acceptable performance for general electronic applications with moderate reliability requirements, balancing quality and cost-effectiveness.

Availability

This PCB is available for worldwide shipping to meet global demand.

Introduction to Rogers TMM4 Base Material

Rogers TMM4 is a thermoset microwave material composed of ceramic, hydrocarbon, and thermoset polymer composite. It is specifically designed for high plated-thru-hole reliability in strip-line and micro-strip applications, integrating the advantages of both ceramic and traditional PTFE laminates without the need for specialized production techniques. As a thermoset resin-based laminate, TMM4 ensures reliable wire-bonding performance without pad lifting or substrate deformation, making it ideal for high-frequency and high-reliability applications.

Key Features of Rogers TMM4 Material

Key Features of Rogers TMM4 Material	Specifications & Descriptions
Dielectric Constant (Dk)	4.50 +/- 0.045 (stable and precise for signal transmission)
Dissipation Factor	0.0020 at 10GHz (low loss, suitable for high-frequency applications)
Thermal Coefficient of Dk	15 ppm/°K (stable dielectric performance across temperature variations)
Coefficient of Thermal Expansion (CTE)	Matched to copper; x=16 ppm/°K, y=16 ppm/°K, z=21 ppm/°K (reduces thermal stress and improves reliability)
Decomposition Temperature (Td)	425 °C (TGA) (high thermal stability)
Thermal Conductivity	0.7 W/mk (effective heat dissipation)
Moisture Absorption	0.07% - 0.18% (low moisture absorption, ensuring performance in humid environments)
Available Thickness Range	0.0015 to 0.500 inches (+/- 0.0015”) (flexible for different design requirements)

Benefits of Using Rogers TMM4 Material

-Mechanical Properties: Resists creep and cold flow, maintaining structural integrity over time

-Chemical Resistance: Resistant to process chemicals, reducing damage during PCB fabrication

-Wire-Bonding Reliability: Thermoset resin base enables reliable wire-bonding without pad lifting or substrate deformation

-High Plated Through-Hole Reliability: Ensures stable electrical connection and long service life

-Process Compatibility: Compatible with all common printed wiring board (PWB) processes, simplifying fabrication and reducing production costs

Typical Applications

-RF and microwave circuitry

-Power amplifiers and combiners

-Filters and couplers

-Satellite communication systems

-Global Positioning Systems (GPS) Antennas

-Patch Antennas

-Dielectric polarizers and lenses

-Chip testers

Double-sided TMM4 PCB 15mil Thick with Immersion Gold Finish 1

Balises:

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

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Laminés revêtus de cuivre

Double-sided TMM4 PCB 15mil Thick with Immersion Gold Finish

Nombre De Pièces:	1 pièces
Prix:	USD9.99-99.99
Emballage Standard:	Sacs sous vide + Cartons
Période De Livraison:	8-9 jours ouvrables
Méthode De Paiement:	T/T
Capacité D'approvisionnement:	5000 pièces par mois

Informations détaillées

Description du produit

Informations détaillées

Lieu d'origine

Chine

Nom de marque

Bicheng

Certification

UL, ISO9001, IATF16949

Numéro de modèle

BIC-470.V1.0

Matériau de base:

Rogers TMM4

Nombre de couches:

2 couches

Épaisseur du PCB:

0,5 mm

Taille du PCB:

102 mm x 85 mm par pièce, avec une tolérance de +/- 0,15 mm

Masque de soudure:

5000 mètres par semaine

Sérigraphie:

5000 mètres par semaine

Poids du cuivre:

1 oz (1,4 mils) pour les couches extérieures

Finition de surface:

Immersion Or

Quantité de commande min:

1 pièces

Prix:

USD9.99-99.99

Détails d'emballage:

Sacs sous vide + Cartons

Délai de livraison:

8-9 jours ouvrables

Conditions de paiement:

T/T

Capacité d'approvisionnement:

5000 pièces par mois

Mettre en évidence

Double-sided TMM4 PCB

15mil thick immersion gold PCB

Rogers PCB with gold finish

Description du produit

PCB specification

Item	Details
Base Material	Rogers TMM4
Layer Count	2 layers (no blind vias)
Board Dimensions	102mm x 85mm per piece, with a tolerance of +/- 0.15mm
Minimum Trace/Space	5/7 mils
Minimum Hole Size	0.4mm
Finished Board Thickness	0.5mm
Finished Copper Weight	1oz (1.4 mils) for outer layers
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Silkscreen	No silkscreen on both top and bottom layers
Solder Mask	No solder mask on both top and bottom layers
Quality Control	100% Electrical test conducted prior to shipment

PCB Stack-up

Layer	Specifications & Descriptions
Copper Layer 1	35 μm (1oz finished copper)
Rogers TMM4 Core	0.381 mm (15 mil) core substrate
Copper Layer 2	35 μm (1oz finished copper)

Double-sided TMM4 PCB 15mil Thick with Immersion Gold Finish 0

Artwork and Standard

Availability

This PCB is available for worldwide shipping to meet global demand.

Introduction to Rogers TMM4 Base Material

Key Features of Rogers TMM4 Material

Key Features of Rogers TMM4 Material	Specifications & Descriptions
Dielectric Constant (Dk)	4.50 +/- 0.045 (stable and precise for signal transmission)
Dissipation Factor	0.0020 at 10GHz (low loss, suitable for high-frequency applications)
Thermal Coefficient of Dk	15 ppm/°K (stable dielectric performance across temperature variations)
Coefficient of Thermal Expansion (CTE)	Matched to copper; x=16 ppm/°K, y=16 ppm/°K, z=21 ppm/°K (reduces thermal stress and improves reliability)
Decomposition Temperature (Td)	425 °C (TGA) (high thermal stability)
Thermal Conductivity	0.7 W/mk (effective heat dissipation)
Moisture Absorption	0.07% - 0.18% (low moisture absorption, ensuring performance in humid environments)
Available Thickness Range	0.0015 to 0.500 inches (+/- 0.0015”) (flexible for different design requirements)

Benefits of Using Rogers TMM4 Material

-Mechanical Properties: Resists creep and cold flow, maintaining structural integrity over time

-Chemical Resistance: Resistant to process chemicals, reducing damage during PCB fabrication

-Wire-Bonding Reliability: Thermoset resin base enables reliable wire-bonding without pad lifting or substrate deformation

-High Plated Through-Hole Reliability: Ensures stable electrical connection and long service life

-Process Compatibility: Compatible with all common printed wiring board (PWB) processes, simplifying fabrication and reducing production costs

Typical Applications

-RF and microwave circuitry

-Power amplifiers and combiners

-Filters and couplers

-Satellite communication systems

-Global Positioning Systems (GPS) Antennas

-Patch Antennas

-Dielectric polarizers and lenses

-Chip testers

Double-sided TMM4 PCB 15mil Thick with Immersion Gold Finish 1

Balises: