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0.2mm Thickness ISO 9001 Certified 49mm x 27mm Size RF PCB Board High Frequency PCB with Rogers RO3010

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0.2mm Thickness ISO 9001 Certified 49mm x 27mm Size RF PCB Board High Frequency PCB with Rogers RO3010

Nombre De Pièces:	1pcs
Prix:	USD9.99-99.99
Emballage Standard:	Sacs à vide + cartons
Période De Livraison:	8-9 jours ouvrables
Méthode De Paiement:	T / t
Capacité D'approvisionnement:	5000pcs par mois

Détails Informations

Description du produit

Informations détaillées

Lieu d'origine

CHINE

Nom de marque

Bicheng

Certification

UL, ISO9001, IATF16949

Numéro de modèle

BIC-052.v1.0

Matériau de base:

Rogers RO3010

Nombre de couches:

Double face

Épaisseur de PCB:

0,2 mm

Taille du PCB:

49 mm x 27 mm = 1pcs

Poids en cuivre:

1 oz (1,4 mils)

Finition de surface:

Énigme

Mettre en évidence:

0.2mm Thickness RF PCB Board

ISO 9001 Certified High Frequency PCB

49mm x 27mm Size Microwave PCB

Description du produit

2-Layer RO3010 RF PCB on 5mil Rogers Laminate

This 2-layer PCB, built with Rogers RO3010 as its base material, is a high-performance electronic component engineered for precision and reliability. Measuring 49mm x 27mm (1 piece), this compact PCB leverages the unique properties of RO3010 to deliver exceptional electrical and mechanical stability, making it ideal for a range of demanding applications.

Rogers RO3010 is a ceramic-filled PTFE composite known for its high dielectric constant and excellent stability. As a cost-effective material with superior mechanical and electrical properties, it simplifies broadband component design and performs reliably across a wide frequency range. Its characteristics also support circuit miniaturization, making it a versatile choice for compact electronic systems.

Construction Details

Parameter	Specification
Layer Count	2-layer
Board Dimensions	49mm x 27mm = 1PCS
Minimum Trace/Space	4/5 mils, enabling precise routing in compact designs without compromising signal integrity
Minimum Hole Size	0.2mm, accommodating small components for space-efficient layouts
Finished Thickness	0.2mm, ultra-thin design suitable for applications with strict space constraints
Outer Cu Weight	1oz (1.4 mils), ensuring reliable conductivity for various current requirements
Via Plating	20μm thick, enhancing interlayer connection durability against thermal and mechanical stress
Surface Finish	ENIG (Electroless Nickel and Immersion Gold), providing superior corrosion resistance and consistent solderability
Silkscreen	White on top (clear component identification), none on bottom (simplified design)
Solder Mask	None on top or bottom, tailored for specific application needs
Electrical Test	100% tested before shipment (checks for shorts, opens, and impedance) to ensure functionality

PCB Stack-up

Layer	Material/Component	Thickness
Copper_layer_1	Copper	35μm
Substrate	Rogers RO3010	5mil (0.127mm)
Copper_layer_2	Copper	35μm

Artwork: Supplied in Gerber RS-274-X format, the industry standard for seamless manufacturing integration.

Quality Standard: Adheres to IPC-Class-2, ensuring consistent performance for general electronic applications.

Availability: Offered worldwide, supporting global supply chains and project needs.

RO3010 Features

Dielectric Constant: 10.2±0.30 at 10 GHz/23°C, providing stable signal propagation for high-frequency designs.

Dissipation Factor: 0.0022 at 10 GHz/23°C, minimizing energy loss for efficient operation.

Low CTE: 13 ppm/°C (X), 11 ppm/°C (Y), 16 ppm/°C (Z) (-55 to 288°C), ensuring dimensional stability across temperature ranges.

High Td: >500°C, maintaining integrity in extreme heat.

Thermal Conductivity: 0.95 W/mK, facilitating effective heat dissipation.

Moisture Absorption: 0.05%, ensuring reliability in humid environments.

Operating Temperature: -40℃ to +85℃, suitable for harsh conditions.

Benefits of Rogers 3010

Dimensional Stability: CTE matched to copper, reducing thermal stress and enhancing reliability.
Cost-Effective: Economical pricing ideal for volume manufacturing.
Quality Assurance: ISO 9001 certified, guaranteeing consistent production standards.
Design Flexibility: Compatible with multi-layer board designs for expanded application potential.

Typical Applications

Automotive radar systems
Global positioning satellite (GPS) antennas
Cellular telecommunications (power amplifiers, antennas)
Wireless communication patch antennas
Direct broadcast satellites
Cable system datalinks
Remote meter readers
Power backplanes

This PCB combines Rogers RO3010's advanced properties with precise engineering, making it a reliable solution for high-frequency, space-constrained, and performance-critical applications. Its compact size, stable performance, and broad compatibility ensure it meets the demands of modern electronic systems.

Balises:

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

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