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RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

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RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

Nombre De Pièces:	1 pièces
Prix:	USD9.99-99.99
Emballage Standard:	Sacs à vide + cartons
Période De Livraison:	8-9 jours ouvrables
Méthode De Paiement:	T/T
Capacité D'approvisionnement:	5000pcs par mois

Détails Informations

Description du produit

Informations détaillées

Lieu d'origine

Chine

Nom de marque

Bicheng

Certification

UL, ISO9001, IATF16949

Numéro de modèle

BIC-332.V1.0

Matériau de base:

F4BTMS450

Nombre de couches:

4 couches

Épaisseur de PCB:

1,4 mm

Taille du PCB:

20 mm x 20 mm par unité (tolérance : ±0,15 mm)

Écran à soigneux:

Masque de soudure:

Poids en cuivre:

1 once (1,4 mils / 35 μm)

Finition superficielle:

or d'immersion

Mettre en évidence:

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

Description du produit

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

This 4-layer rigid PCB uses aerospace-grade F4BTM450 material to deliver superior electrical, thermal, and mechanical performance for high-frequency, mission-critical systems. Meeting IPC-Class-2 standards, it provides a high-reliability solution for aerospace, microwave, and military applications and serves as a competitive alternative to premium imported options.

PCB Specification

Parameter	Specification
Base Material	F4BTMS450 (advanced PTFE-nano-ceramic composite)
Layer Configuration	4-layer rigid PCB
Board Dimensions	20mm x 20mm per unit (tolerance: ±0.15mm)
Finished Board Thickness	1.4mm
Copper Weight (Finished)	1oz (1.4 mils / 35μm)
Via Plating Thickness	20μm
Minimum Trace/Space	4 mils / 5 mils
Minimum Hole Size	0.3mm
Vias	4 total (no blind vias)
Surface Finish	Immersion Gold
Silkscreen	Top: No; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

Precise PCB Stack-up

Copper Layer 1: 35μm (1oz)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 2: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 3: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.762mm (30mil)
Copper Layer 4: 35μm (1oz)

F4BTMS450 Material Advantages

F4BTMS450 is an upgraded iteration of the F4BTM series, featuring a breakthrough formulation of polytetrafluoroethylene (PTFE) resin, ultra-thin/ultra-fine glass fiber cloth, and uniformly distributed special nano-ceramics. Key benefits include:

Minimized electromagnetic wave propagation interference from glass fibers, reducing dielectric loss.
Enhanced dimensional stability and reduced X/Y/Z anisotropy, ensuring consistency across extreme conditions.
Extended usable frequency range, improved electrical strength, and superior thermal conductivity.
Low thermal expansion coefficient and stable dielectric temperature characteristics.
Standard RTF (Reverse Treat Foil) low-roughness copper foil, reducing conductor loss and delivering excellent peel strength (compatible with copper or aluminum bases).

F4BTMS450 Key Electrical & Mechanical Properties

Property	Specification
Dielectric Constant (Dk)	4.5 ±0.09 (10GHz)
Dissipation Factor (Df)	0.0015 (10GHz); 0.0019 (20GHz)
Coefficient of Thermal Expansion (CTE)	X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 45 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk	-58 ppm/°C (-55°C to 150°C)
Flame Rating	UL-94 V0
Thermal Conductivity	0.64 W/MK
Moisture Absorption	0.08% (max)

Typical Applications

This PCB is ideal for demanding environments and high-performance systems, including:

Aerospace equipment, space vehicles, and cabin systems
Microwave and RF (Radio Frequency) devices
Military radar and general radar systems
Feed networks for high-frequency applications
Phase-sensitive antennas and phased array antennas
Satellite communications systems
Other mission-critical electronics requiring stable performance under extreme temperatures and conditions.

Balises:

Produits

Nombre De Pièces:	1 pièces
Prix:	USD9.99-99.99
Emballage Standard:	Sacs à vide + cartons
Période De Livraison:	8-9 jours ouvrables
Méthode De Paiement:	T/T
Capacité D'approvisionnement:	5000pcs par mois

Informations détaillées

Description du produit

Informations détaillées

Lieu d'origine

Chine

Nom de marque

Bicheng

Certification

UL, ISO9001, IATF16949

Numéro de modèle

BIC-332.V1.0

Matériau de base:

F4BTMS450

Nombre de couches:

4 couches

Épaisseur de PCB:

1,4 mm

Taille du PCB:

20 mm x 20 mm par unité (tolérance : ±0,15 mm)

Écran à soigneux:

Non

Masque de soudure:

Non

Poids en cuivre:

1 once (1,4 mils / 35 μm)

Finition superficielle:

or d'immersion

Quantité de commande min:

1 pièces

Prix:

USD9.99-99.99

Détails d'emballage:

Sacs à vide + cartons

Délai de livraison:

8-9 jours ouvrables

Conditions de paiement:

T/T

Capacité d'approvisionnement:

5000pcs par mois

Mettre en évidence

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

Description du produit

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

PCB Specification

Parameter	Specification
Base Material	F4BTMS450 (advanced PTFE-nano-ceramic composite)
Layer Configuration	4-layer rigid PCB
Board Dimensions	20mm x 20mm per unit (tolerance: ±0.15mm)
Finished Board Thickness	1.4mm
Copper Weight (Finished)	1oz (1.4 mils / 35μm)
Via Plating Thickness	20μm
Minimum Trace/Space	4 mils / 5 mils
Minimum Hole Size	0.3mm
Vias	4 total (no blind vias)
Surface Finish	Immersion Gold
Silkscreen	Top: No; Bottom: No
Solder Mask	Top: No; Bottom: No
Quality Assurance	100% Electrical test prior to shipment

Precise PCB Stack-up

Copper Layer 1: 35μm (1oz)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 2: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.127mm (5mil)
Copper Layer 3: 35μm (1oz)
Prepreg RO4450F: 0.102mm (4mil)
F4BTMS450 Core: 0.762mm (30mil)
Copper Layer 4: 35μm (1oz)

F4BTMS450 Material Advantages

Minimized electromagnetic wave propagation interference from glass fibers, reducing dielectric loss.
Enhanced dimensional stability and reduced X/Y/Z anisotropy, ensuring consistency across extreme conditions.
Extended usable frequency range, improved electrical strength, and superior thermal conductivity.
Low thermal expansion coefficient and stable dielectric temperature characteristics.
Standard RTF (Reverse Treat Foil) low-roughness copper foil, reducing conductor loss and delivering excellent peel strength (compatible with copper or aluminum bases).

F4BTMS450 Key Electrical & Mechanical Properties

Property	Specification
Dielectric Constant (Dk)	4.5 ±0.09 (10GHz)
Dissipation Factor (Df)	0.0015 (10GHz); 0.0019 (20GHz)
Coefficient of Thermal Expansion (CTE)	X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 45 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk	-58 ppm/°C (-55°C to 150°C)
Flame Rating	UL-94 V0
Thermal Conductivity	0.64 W/MK
Moisture Absorption	0.08% (max)

Typical Applications

This PCB is ideal for demanding environments and high-performance systems, including:

Aerospace equipment, space vehicles, and cabin systems
Microwave and RF (Radio Frequency) devices
Military radar and general radar systems
Feed networks for high-frequency applications
Phase-sensitive antennas and phased array antennas
Satellite communications systems
Other mission-critical electronics requiring stable performance under extreme temperatures and conditions.

Balises:

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Carte PCB de noyau en métal

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

1oz RF PCB Board,

1.6mm RF PCB Board,

Panneau de carte PCB de rf

Panneau de carte PCB de Rogers

Panneau de carte PCB de PTFE

Carte PCB élevée de Tg

Carte PCB multi de couche

Carte PCB taconique

Panneau de carte PCB de HDI

Carte PCB à grande vitesse

L'impédance a commandé la carte PCB

Panneau flexible de carte PCB

panneau de la carte PCB fr4

pochoir de carte PCB

Carte PCB de noyau en métal

RF PCB board 4-layer design

Microwave PCB 1.4mm thickness

F4BTMS450 RF PCB board

1oz RF PCB Board,

1.6mm RF PCB Board,