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F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold

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F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold

Nombre De Pièces:	1pcs
Prix:	USD9.99-99.99
Emballage Standard:	Sacs à vide + cartons
Période De Livraison:	8-9 jours ouvrables
Méthode De Paiement:	T / t
Capacité D'approvisionnement:	5000pcs par mois

Détails Informations

Description du produit

Informations détaillées

Lieu d'origine

CHINE

Nom de marque

Bicheng

Certification

UL, ISO9001, IATF16949

Numéro de modèle

BIC-052.v1.0

Matériau de base:

F4BTMS255

Nombre de couches:

2 couches

Épaisseur de PCB:

1,6 mm

Taille du PCB:

87 mm x 80 mm (±0,15 mm)

Poids en cuivre:

1 oz (1,4 mils) sur les couches extérieures

Finition de surface:

or d'immersion

Mettre en évidence:

RF PCB double-sided 60mil thick

immersion gold RF PCB board

double-sided PCB with immersion gold

Description du produit

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold

This double-sided PCB is engineered to meet the rigorous demands of high-reliability industries. It utilizes the advanced F4BTMS255 base material to deliver exceptional signal integrity, thermal stability, and mechanical durability. The board is compliant with IPC-Class-2 standards, undergoes 100% electrical testing prior to shipment, and is available for worldwide shipping.

Core Advantage: F4BTMS255 Aerospace-Grade Base Material

The F4BTMS255 is an upgraded flagship material, building on the F4BTM series with breakthroughs in formulation and manufacturing. It combines ultra-thin ultra-fine glass fiber cloth and uniformly distributed nano-ceramics with PTFE resin, minimizing glass fiber interference on electromagnetic waves while boosting key performance metrics. This makes it a direct replacement for premium foreign materials, ideal for aerospace and high-frequency applications.

Key Features of F4BTMS255

Performance Indicator	Specification
Dielectric Constant (Dk)	2.55 ± 0.04 at 10GHz (stable for high-frequency signals)
Dissipation Factor	0.0012 at 10GHz; 0.0013 at 20GHz (ultra-low loss for signal integrity)
CTE (Coefficient of Thermal Expansion)	X-axis: 15 ppm/°C; Y-axis: 20 ppm/°C; Z-axis: 80 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk	-92 ppm/°C (-55°C to 150°C, ensures stable performance across temperatures)
Flame Rating	UL-94 V0 (enhanced safety for critical environments)
Moisture Absorption	0.025% (resists environmental degradation for long-term reliability)

It also includes RTF low-roughness copper foil as standard (reduces conductor loss, improves peel strength) and is compatible with both copper and aluminum bases.

1. PCB Specifications

Parameter	Details & Benefits
Layer Count	Double-sided (2-layer rigid PCB) – balances performance and design flexibility
Board Dimensions	87mm x 80mm per piece (tolerance: ±0.15mm) – precise for consistent assembly
Minimum Trace/Space	5/7 mils – supports dense circuitry for compact, high-density designs
Minimum Hole Size	0.3mm (no blind vias) – simplifies assembly and reduces production complexity
Finished Board Thickness	1.6mm – consistent thickness for reliable mounting and mechanical stability
Finished Copper Weight	1oz (1.4 mils); 35μm per copper layer – ensures strong current carrying capacity
Via Plating Thickness	20μm – guarantees robust electrical connectivity between layers
Surface Finish	Immersion Gold – superior corrosion resistance, excellent solderability, and long-term reliability
Silkscreen	Top: White; Bottom: None – clear component labeling (top side) without unnecessary bottom-side interference
Solder Mask	Top: None; Bottom: None – ideal for applications requiring unobstructed signals (e.g., RF, microwave)
Quality Assurance	100% Electrical Test prior to shipment – eliminates defects, ensures 100% functionality

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold 0

2. PCB Stack-up

Layer Order	Material	Thickness
1	Copper Layer 1	35μm
2	F4BTMS255 Core	1.524mm (60mil)
3	Copper Layer 2	35μm

3. Quality Compliance

Artwork Format: Gerber RS-274-X (industry-standard format for seamless manufacturing collaboration)

Quality Standard: IPC-Class-2 (meets strict criteria for commercial/industrial applications, ensuring consistent quality)

4. Typical Applications

This PCB is engineered for scenarios where performance and reliability are non-negotiable:

-Aerospace equipment (spacecraft, cabin systems)

-Microwave and RF devices

-Military/commercial radar systems

-Feed networks

-Phase-sensitive antennas (phased array antennas)

-Satellite communications systems

5. Global Availability

We offer worldwide shipping, ensuring timely delivery to support your projects—whether you operate in North America, Europe, Asia, or beyond.

Ready to Start Your Project?

If you need a high-performance PCB for aerospace, RF, or critical applications, contact us today for a custom quote or technical consultation.

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold 1

Balises:

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

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F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold

Nombre De Pièces:	1pcs
Prix:	USD9.99-99.99
Emballage Standard:	Sacs à vide + cartons
Période De Livraison:	8-9 jours ouvrables
Méthode De Paiement:	T / t
Capacité D'approvisionnement:	5000pcs par mois

Informations détaillées

Description du produit

Informations détaillées

Lieu d'origine

CHINE

Nom de marque

Bicheng

Certification

UL, ISO9001, IATF16949

Numéro de modèle

BIC-052.v1.0

Matériau de base:

F4BTMS255

Nombre de couches:

2 couches

Épaisseur de PCB:

1,6 mm

Taille du PCB:

87 mm x 80 mm (±0,15 mm)

Poids en cuivre:

1 oz (1,4 mils) sur les couches extérieures

Finition de surface:

or d'immersion

Quantité de commande min:

1pcs

Prix:

USD9.99-99.99

Détails d'emballage:

Sacs à vide + cartons

Délai de livraison:

8-9 jours ouvrables

Conditions de paiement:

T / t

Capacité d'approvisionnement:

5000pcs par mois

Mettre en évidence

RF PCB double-sided 60mil thick

immersion gold RF PCB board

double-sided PCB with immersion gold

Description du produit

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold

Core Advantage: F4BTMS255 Aerospace-Grade Base Material

Key Features of F4BTMS255

Performance Indicator	Specification
Dielectric Constant (Dk)	2.55 ± 0.04 at 10GHz (stable for high-frequency signals)
Dissipation Factor	0.0012 at 10GHz; 0.0013 at 20GHz (ultra-low loss for signal integrity)
CTE (Coefficient of Thermal Expansion)	X-axis: 15 ppm/°C; Y-axis: 20 ppm/°C; Z-axis: 80 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk	-92 ppm/°C (-55°C to 150°C, ensures stable performance across temperatures)
Flame Rating	UL-94 V0 (enhanced safety for critical environments)
Moisture Absorption	0.025% (resists environmental degradation for long-term reliability)

It also includes RTF low-roughness copper foil as standard (reduces conductor loss, improves peel strength) and is compatible with both copper and aluminum bases.

1. PCB Specifications

Parameter	Details & Benefits
Layer Count	Double-sided (2-layer rigid PCB) – balances performance and design flexibility
Board Dimensions	87mm x 80mm per piece (tolerance: ±0.15mm) – precise for consistent assembly
Minimum Trace/Space	5/7 mils – supports dense circuitry for compact, high-density designs
Minimum Hole Size	0.3mm (no blind vias) – simplifies assembly and reduces production complexity
Finished Board Thickness	1.6mm – consistent thickness for reliable mounting and mechanical stability
Finished Copper Weight	1oz (1.4 mils); 35μm per copper layer – ensures strong current carrying capacity
Via Plating Thickness	20μm – guarantees robust electrical connectivity between layers
Surface Finish	Immersion Gold – superior corrosion resistance, excellent solderability, and long-term reliability
Silkscreen	Top: White; Bottom: None – clear component labeling (top side) without unnecessary bottom-side interference
Solder Mask	Top: None; Bottom: None – ideal for applications requiring unobstructed signals (e.g., RF, microwave)
Quality Assurance	100% Electrical Test prior to shipment – eliminates defects, ensures 100% functionality

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold 0

2. PCB Stack-up

Layer Order	Material	Thickness
1	Copper Layer 1	35μm
2	F4BTMS255 Core	1.524mm (60mil)
3	Copper Layer 2	35μm

3. Quality Compliance

Artwork Format: Gerber RS-274-X (industry-standard format for seamless manufacturing collaboration)

Quality Standard: IPC-Class-2 (meets strict criteria for commercial/industrial applications, ensuring consistent quality)

4. Typical Applications

This PCB is engineered for scenarios where performance and reliability are non-negotiable:

-Aerospace equipment (spacecraft, cabin systems)

-Microwave and RF devices

-Military/commercial radar systems

-Feed networks

-Phase-sensitive antennas (phased array antennas)

-Satellite communications systems

5. Global Availability

We offer worldwide shipping, ensuring timely delivery to support your projects—whether you operate in North America, Europe, Asia, or beyond.

Ready to Start Your Project?

If you need a high-performance PCB for aerospace, RF, or critical applications, contact us today for a custom quote or technical consultation.

F4BTMS255 PCB Double-Sided 60mil Thick with Immersion Gold 1

Balises: