F4BME294 Substrate High Frequency Laminates Copper Clad Sheet

F4BME294 is manufactured using glass fabric, PTFE resin, and PTFE film through a scientifically formulated composition and rigorous processing techniques. Its electrical performance represents an improvement over F4B, primarily characterized by a wider dielectric constant range, lower dielectric loss, increased insulation resistance, and enhanced stability, making it a suitable substitute for similar foreign products.

The F4BM and F4BME share the same dielectric layer but differ in the type of copper foil used: F4BM is paired with ED copper foil and is suitable for applications without PIM requirements; F4BME is paired with reverse-treated RTF copper foil, offering excellent PIM performance, more precise circuit control, and lower conductor loss.

F4BM and F4BME achieve precise dielectric constant adjustment by optimizing the ratio of PTFE to glass fabric. This approach not only delivers low loss but also enhances dimensional stability. A higher dielectric constant corresponds to a higher glass fabric content, resulting in improved dimensional stability, lower coefficient of thermal expansion, better temperature drift characteristics, and a slight increase in dielectric loss.

Product Features

• DK values available from 2.17 to 3.0, with customizable DK options
• Low loss
• F4BME with RTF copper foil provides excellent PIM performance
• Various dimensional options for cost efficiency
• Radiation resistant and low outgassing
• Commercial-scale, high-volume, cost-effective solution

Typical Applications

• Microwave, RF, and radar systems
• Phase shifters, passive components
• Power dividers, couplers, combiners
• Feed networks, phased array antennas
• Satellite communications, base station antennas