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6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

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6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

Nombre De Pièces:	1 pièces
Prix:	USD9.99-99.99
Emballage Standard:	Sacs à vide + cartons
Période De Livraison:	8-9 jours ouvrables
Méthode De Paiement:	T/T
Capacité D'approvisionnement:	5000pcs par mois

Détails Informations

Description du produit

Informations détaillées

Lieu d'origine

Chine

Nom de marque

Bicheng

Certification

UL, ISO9001, IATF16949

Numéro de modèle

BIC-332.V1.0

Matériau de base:

RO4350B + FR-4 à Tg élevé (S1000-2M)

Nombre de couches:

6 couches

Épaisseur de PCB:

1,3 mm

Taille du PCB:

30,55 mm x 37,7 mm (1 pièce) avec une tolérance de ±0,15 mm

Écran à soigneux:

Blanc

Masque de soudure:

Poids en cuivre:

1 oz (1,4 mils) pour les couches intérieures/extérieures

Finition superficielle:

Or à immersion au nickel autocatalytique et au palladium (ENEPIG)

Mettre en évidence:

6-layer hybrid PCB RO4350B

high Tg FR-4 PCB

blind vias multilayer PCB

Description du produit

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

This 6-layer hybrid PCB combines Rogers RO4350B (high-frequency laminate) and High Tg FR-4 (S1000-2M) to optimize performance for high-frequency, mission-critical applications.

PCB Specification

Construction Parameter	Specification
Base Material	RO4350B + High Tg FR-4 (S1000-2M)
Layer Count	6-layer
Board Dimensions	30.55mm x 37.7mm (1 piece) with tolerance of ±0.15mm
Minimum Trace/Space	4 mils / 4 mils
Minimum Hole Size	0.25mm
Vias (Special Types)	Blind vias (L1-L2)
Finished Board Thickness	1.3mm
Finished Copper Weight (Inner/Outer Layers)	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Top Silkscreen	White
Bottom Silkscreen	White
Top Solder Mask	No
Bottom Solder Mask	Green
Quality Assurance (Electrical Testing)	100% Electrical test performed prior to shipment

Hybrid PCB Stack-up

Layer Sequence	Layer Type	Specification	Thickness
1	Copper Layer (Top)	Copper_layer_1	35 μm
2	Laminate	RO4350B	0.102mm (4mil)
3	Copper Layer	Copper_layer_2	35 μm
4	Prepreg	1080 RC63% + 7628 (43%)	0.254mm (10mil)
5	Copper Layer	Copper_layer_3	35 μm
6	Core Material	S1000-2M	0.254mm (10mil)
7	Copper Layer	Copper_layer_4	35 μm
8	Prepreg	1080 RC63% + 7628 (43%)	0.254mm (10mil)
9	Copper Layer	Copper_layer_5	35 μm
10	Core Material	S1000-2M	0.254mm (10mil)
11	Copper Layer (Bottom)	Copper_layer_6	35 μm

What is a Hybrid PCB?

A hybrid PCB (also known as a mixed-material PCB) is a specialized circuit board that integrates two or more distinct base materials in its stack-up, each selected to optimize specific performance attributes. Unlike single-material PCBs, which must compromise on certain properties, hybrid PCBs leverage the strengths of each material to address diverse design requirements.

Rogers RO4350B Material Overview

Rogers RO4350B is a proprietary laminate composed of woven glass reinforcement blended with hydrocarbon/ceramic compounds, striking a balance between PTFE/woven glass-like electrical performance and the manufacturing simplicity of epoxy/glass materials.

Tailored for high-frequency applications, RO4350B laminates offer tightly controlled dielectric constant (Dk) and maintain ultra-low signal loss--all while being processable using standard epoxy/glass manufacturing workflows. A cost-effective alternative to traditional microwave laminates, RO4350B eliminates the need for specialized through-hole treatments or handling procedures required by PTFE-based materials. It also holds a UL 94 V-0 flammability rating, making it suitable for active electronic devices and high-power RF designs.

RO4350B Properties

Property	Specification
Material Type	Proprietary woven glass reinforced hydrocarbon/ceramic laminate
Dielectric Constant (Dk)	3.48 ±0.05 (measured at 10GHz/23°C)
Dissipation Factor (Df)	0.0037 (measured at 10GHz/23°C)
Thermal Conductivity	0.69 W/m/°K
Coefficient of Thermal Expansion (CTE)	X-axis: 10 ppm/°C Y-axis: 12 ppm/°C Z-axis: 32 ppm/°C
Glass Transition Temperature (Tg)	>280°C (536°F)
Moisture Absorption	0.06% (max)
Flammability Rating	UL 94 V-0

Core Features (S1000-2M High Tg FR-4)

Reduced Z-axis CTE, enhancing through-hole reliability in demanding environments
Superior mechanical processability paired with exceptional thermal resistance
Lead-free soldering compatibility, aligning with modern manufacturing standards
Glass Transition Temperature (Tg): 180°C (per DSC testing); UV-blocking properties for AOI compatibility
Outstanding high-heat endurance for stable performance in elevated temperature conditions
Excellent Anti-CAF (Conductive Anodic Filtration) performance, mitigating long-term reliability risks
Minimal moisture absorption, ensuring durability in humid operating environments

Typical Applications

Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter Wave Systems
Radar & Guidance Systems
Point-to-Point Digital Radio Antennas

Balises:

Produits

Nombre De Pièces:	1 pièces
Prix:	USD9.99-99.99
Emballage Standard:	Sacs à vide + cartons
Période De Livraison:	8-9 jours ouvrables
Méthode De Paiement:	T/T
Capacité D'approvisionnement:	5000pcs par mois

Informations détaillées

Description du produit

Informations détaillées

Lieu d'origine

Chine

Nom de marque

Bicheng

Certification

UL, ISO9001, IATF16949

Numéro de modèle

BIC-332.V1.0

Matériau de base:

RO4350B + FR-4 à Tg élevé (S1000-2M)

Nombre de couches:

6 couches

Épaisseur de PCB:

1,3 mm

Taille du PCB:

30,55 mm x 37,7 mm (1 pièce) avec une tolérance de ±0,15 mm

Écran à soigneux:

Blanc

Masque de soudure:

Vert

Poids en cuivre:

1 oz (1,4 mils) pour les couches intérieures/extérieures

Finition superficielle:

Or à immersion au nickel autocatalytique et au palladium (ENEPIG)

Quantité de commande min:

1 pièces

Prix:

USD9.99-99.99

Détails d'emballage:

Sacs à vide + cartons

Délai de livraison:

8-9 jours ouvrables

Conditions de paiement:

T/T

Capacité d'approvisionnement:

5000pcs par mois

Mettre en évidence

6-layer hybrid PCB RO4350B

high Tg FR-4 PCB

blind vias multilayer PCB

Description du produit

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

This 6-layer hybrid PCB combines Rogers RO4350B (high-frequency laminate) and High Tg FR-4 (S1000-2M) to optimize performance for high-frequency, mission-critical applications.

PCB Specification

Construction Parameter	Specification
Base Material	RO4350B + High Tg FR-4 (S1000-2M)
Layer Count	6-layer
Board Dimensions	30.55mm x 37.7mm (1 piece) with tolerance of ±0.15mm
Minimum Trace/Space	4 mils / 4 mils
Minimum Hole Size	0.25mm
Vias (Special Types)	Blind vias (L1-L2)
Finished Board Thickness	1.3mm
Finished Copper Weight (Inner/Outer Layers)	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Top Silkscreen	White
Bottom Silkscreen	White
Top Solder Mask	No
Bottom Solder Mask	Green
Quality Assurance (Electrical Testing)	100% Electrical test performed prior to shipment

Hybrid PCB Stack-up

Layer Sequence	Layer Type	Specification	Thickness
1	Copper Layer (Top)	Copper_layer_1	35 μm
2	Laminate	RO4350B	0.102mm (4mil)
3	Copper Layer	Copper_layer_2	35 μm
4	Prepreg	1080 RC63% + 7628 (43%)	0.254mm (10mil)
5	Copper Layer	Copper_layer_3	35 μm
6	Core Material	S1000-2M	0.254mm (10mil)
7	Copper Layer	Copper_layer_4	35 μm
8	Prepreg	1080 RC63% + 7628 (43%)	0.254mm (10mil)
9	Copper Layer	Copper_layer_5	35 μm
10	Core Material	S1000-2M	0.254mm (10mil)
11	Copper Layer (Bottom)	Copper_layer_6	35 μm

What is a Hybrid PCB?

Rogers RO4350B Material Overview

RO4350B Properties

Property	Specification
Material Type	Proprietary woven glass reinforced hydrocarbon/ceramic laminate
Dielectric Constant (Dk)	3.48 ±0.05 (measured at 10GHz/23°C)
Dissipation Factor (Df)	0.0037 (measured at 10GHz/23°C)
Thermal Conductivity	0.69 W/m/°K
Coefficient of Thermal Expansion (CTE)	X-axis: 10 ppm/°C Y-axis: 12 ppm/°C Z-axis: 32 ppm/°C
Glass Transition Temperature (Tg)	>280°C (536°F)
Moisture Absorption	0.06% (max)
Flammability Rating	UL 94 V-0

Core Features (S1000-2M High Tg FR-4)

Reduced Z-axis CTE, enhancing through-hole reliability in demanding environments
Superior mechanical processability paired with exceptional thermal resistance
Lead-free soldering compatibility, aligning with modern manufacturing standards
Glass Transition Temperature (Tg): 180°C (per DSC testing); UV-blocking properties for AOI compatibility
Outstanding high-heat endurance for stable performance in elevated temperature conditions
Excellent Anti-CAF (Conductive Anodic Filtration) performance, mitigating long-term reliability risks
Minimal moisture absorption, ensuring durability in humid operating environments

Typical Applications

Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter Wave Systems
Radar & Guidance Systems
Point-to-Point Digital Radio Antennas

Balises:

Panneau de carte PCB de rf

Panneau de carte PCB de Rogers

Panneau de carte PCB de PTFE

Carte PCB élevée de Tg

Carte PCB multi de couche

Carte PCB taconique

Panneau de carte PCB de HDI

Carte PCB à grande vitesse

L'impédance a commandé la carte PCB

Panneau flexible de carte PCB

panneau de la carte PCB fr4

pochoir de carte PCB

Carte PCB de noyau en métal

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

6-layer hybrid PCB RO4350B

high Tg FR-4 PCB

blind vias multilayer PCB

Carte PCB multi de la couche 2OZ,

4 couches de carte multicouche,

Panneau de carte PCB de rf

Panneau de carte PCB de Rogers

Panneau de carte PCB de PTFE

Carte PCB élevée de Tg

Carte PCB multi de couche

Carte PCB taconique

Panneau de carte PCB de HDI

Carte PCB à grande vitesse

L'impédance a commandé la carte PCB

Panneau flexible de carte PCB

panneau de la carte PCB fr4

pochoir de carte PCB

Carte PCB de noyau en métal

6-layer hybrid PCB RO4350B

high Tg FR-4 PCB

blind vias multilayer PCB

Carte PCB multi de la couche 2OZ,

4 couches de carte multicouche,