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6-Layer Rogers PCB Board with 1.6mm Thickness and 100% Electrical Test for High-Frequency Applications

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Certificat
LA CHINE Bicheng Electronics Technology Co., Ltd certifications
LA CHINE Bicheng Electronics Technology Co., Ltd certifications
Examens de client
Kevin, A reçu et a examiné les panneaux - mercis beaucoup. Ce sont parfaits, exactement de ce que nous avons eu besoin. rgds Riches

—— Rich Rickett

Ruth, J'ai obtenu la carte PCB aujourd'hui, et ils sont simplement parfaits. Veuillez rester une peu de patience, mon prochain ordre viendra bientôt. Sincères amitiés de Hambourg Olaf

—— Olaf Kühnhold

Salut Natalie. Il était parfait, j'attachent quelques images pour votre référence. Et je t'envoie des 2 prochains projets pour économiser. Merci beaucoup encore

—— Sebastian Toplisek

Kevin, Merci, ils ont été parfaitement faits, et fonctionnent bien. Comme promis, voici les liens pour mon dernier projet, utilisant le PCBs que vous avez fabriqué pour moi : Cordialement, Daniel

—— Daniel Ford

Je suis en ligne une discussion en ligne

6-Layer Rogers PCB Board with 1.6mm Thickness and 100% Electrical Test for High-Frequency Applications

6-Layer Rogers PCB Board with 1.6mm Thickness and 100% Electrical Test for High-Frequency Applications
6-Layer Rogers PCB Board with 1.6mm Thickness and 100% Electrical Test for High-Frequency Applications 6-Layer Rogers PCB Board with 1.6mm Thickness and 100% Electrical Test for High-Frequency Applications

Image Grand :  6-Layer Rogers PCB Board with 1.6mm Thickness and 100% Electrical Test for High-Frequency Applications

Détails sur le produit:
Lieu d'origine: CHINE
Nom de marque: Bicheng
Certification: UL, ISO9001, IATF16949
Numéro de modèle: BIC-052.v1.0
Conditions de paiement et expédition:
Quantité de commande min: 1pcs
Prix: USD9.99-99.99
Détails d'emballage: Sacs à vide + cartons
Délai de livraison: 8-9 jours ouvrables
Conditions de paiement: T / t
Capacité d'approvisionnement: 5000pcs par mois
Contact

6-Layer Rogers PCB Board with 1.6mm Thickness and 100% Electrical Test for High-Frequency Applications

description de
Matériau de base: Ro4350b de Rogers Nombre de couches: 6 couches
Épaisseur de PCB: 1,6 mm Taille du PCB: 110 mm × 80 mm ± 0,15 mm
Poids en cuivre: 1 oz (1,4 mils) pour les couches intérieures et extérieures Finition de surface: Gol d'immersion nickel électrolaire (ENIG)
Mettre en évidence:

6-Layer Rogers PCB Board

,

1.6mm Thickness PCB Board

,

100% Electrical Test RF PCB

Rogers RO4350B 6-Layer PCB: 1.6mm Thickness 100% Electrical Test

This is a 6-layer high-performance PCB constructed with Rogers RO4350B laminate, a woven glass-reinforced hydrocarbon/ceramic composite engineered for high-frequency applications. The PCB integrates advanced material properties with precision manufacturing to deliver exceptional electrical performance, structural stability, and cost-effectiveness for RF and microwave systems.

PCB Specifications
Parameter Technical Details Engineering Significance
Base Material Rogers RO4350B (woven glass reinforced hydrocarbon/ceramic composite) Combines PTFE-like electrical performance with epoxy/glass manufacturability, ideal for high-frequency applications
Layer Count 6-layer rigid configuration Supports complex signal routing with dedicated power/ground planes for EMI control
Board Dimensions 110mm × 80mm ±0.15mm Ensures dimensional stability for automated assembly and enclosure fitting
Minimum Trace/Space 4/4 mils Enables high-density routing with minimal crosstalk in RF circuits
Minimum Hole Size 0.3mm Accommodates fine-pitch components while maintaining structural integrity
Vias 455 total; blind vias (L1-L4, L5-L6); 20μm plating thickness Reduces signal path length and minimizes reflections in high-speed designs
Finished Thickness 1.6mm Provides optimal balance between structural rigidity and weight
Copper Weight 1oz (35μm) for inner and outer layers Ensures low resistance while maintaining high-frequency performance
Surface Finish Electroless Nickel Immersion Gold (ENIG) Delivers excellent corrosion resistance, solderability, and stable RF contact resistance
Silkscreen White on both top and bottom layers Facilitates component identification and assembly verification
Solder Mask Green on both top and bottom layers Protects copper traces while providing environmental resistance
Quality Assurance 100% electrical testing (continuity, isolation, and impedance) Verifies compliance with design specifications prior to deployment
Stack-up Configuration

The 6-layer stack-up is engineered for optimal signal integrity and controlled impedance:

Layer Sequence Material/Component Thickness Function
1 Copper Layer 1 35μm Primary signal layer for high-frequency traces
2 Rogers RO4350B Core 0.254mm (10mil) Dielectric layer with controlled Dk for impedance management
3 Copper Layer 2 35μm Ground plane for Layer 1 signals
4 Prepreg RO4450F (x2) 0.2mm Bonding layer with compatible dielectric properties
5 Copper Layer 3 35μm Power distribution layer
6 Rogers RO4350B Core 0.508mm (20mil) Central dielectric providing isolation between planes
7 Copper Layer 4 35μm Secondary ground plane
8 Prepreg RO4450F (x2) 0.2mm Intermediate bonding layer
9 Copper Layer 5 35μm Secondary signal layer
10 Rogers RO4350B Core 0.254mm (10mil) Bottom dielectric layer
11 Copper Layer 6 35μm Auxiliary signal routing layer
6-layer RO4350B PCB showing detailed board layout and components
RO4350B Material Properties

Rogers RO4350B laminate exhibits key characteristics that enhance PCB performance:

Property Value Technical Impact
Dielectric Constant (Dk) 3.48 ±0.05 @ 10GHz/23°C Ensures consistent signal propagation with minimal variation
Dissipation Factor (Df) 0.0037 @ 10GHz/23°C Minimizes signal loss in high-frequency applications
Thermal Conductivity 0.69 W/m/°K Facilitates efficient heat dissipation from active components
CTE (X/Y/Z) 10/12/32 ppm/°C Matches copper expansion to reduce thermal stress and via fatigue
Glass Transition Temperature (Tg) >280°C Maintains stability during high-temperature processing and operation
Water Absorption 0.06% Prevents performance degradation in humid environments
Flammability Rating UL 94 V-0 Enables use in applications requiring fire safety compliance
Manufacturing and Quality
  • Artwork Format: Gerber RS-274-X, ensuring compatibility with standard PCB fabrication processes
  • Quality Standard: IPC-Class-2 compliance, guaranteeing reliable performance for general electronics applications
  • Processing Compatibility: Compatible with standard FR-4 manufacturing workflows, eliminating the need for specialized processing required by PTFE-based materials
Application-Specific Advantages

The PCB's design and material selection make it particularly suitable for:

  • Cellular Base Stations: Low dielectric loss ensures efficient signal transmission in power amplifiers and antenna systems
  • Automotive Radar: Dimensional stability and thermal performance withstand harsh automotive environments
  • RF Identification Systems: Controlled impedance characteristics support reliable wireless communication
  • Satellite LNBs: Tight Dk tolerance enables precise phase matching in frequency conversion circuits
Close-up view of RO4350B PCB showing surface finish and trace details
Availability

This PCB is available for worldwide shipping, supporting global project requirements.

Conclusion

This 6-layer RO4350B PCB combines advanced material properties with optimized stack-up construction to deliver exceptional performance in high-frequency applications. Its balance of electrical performance, manufacturability, and cost-effectiveness makes it an ideal solution for demanding RF and microwave systems.

Finished RO4350B PCB assembly showing complete board with components

Produit Tag:

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Coordonnées
Bicheng Electronics Technology Co., Ltd

Personne à contacter: Ms. Ivy Deng

Téléphone: 86-755-27374946

Télécopieur: 86-755-27374848

Envoyez votre demande directement à nous (0 / 3000)

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